TANAKA PRECIOUS METAL TECHNOLOGIES develops AgSn TLP Sheet, a sheet material for connecting power semiconductors Investing.com

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TOKYO, January 23, 2025 – (JCN Newswire) – – TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head Office: Chuo-ku, Tokyo; Representative Director and CEO: Koichiro Tanaka), which is engaged in the industrial precious metals business of TANAKA, has announced the development of AgSn TLP sheet, a sheet bonding material designed for die attachment in power semiconductor package manufacturing. In addition, the AgSn TLP sheet is expected to serve as an alternative to thermal interface materials1 (TIM) for large-area bonding in heat sinks, further expanding its potential applications.

Bonding sheet material that enables bonding of large silicon (Si) chips under high current

In recent years, the demand for high-current semiconductors aimed at applications such as electric vehicles, hybrid vehicles and industrial infrastructure has been increasing. As such, in the bonding of large Si chips, there are requirements for materials that can enable bonding of large areas with a guarantee of high reliability. The AgSn TLP sheet announcement states that it can be used to bond semiconductor chips up to 20mm. Furthermore, it enables bonding at a low pressure of 3.3 MPa, contributing to improved yields in semiconductor manufacturing.

Low temperature bonding and high thermal resistance are required for power semiconductors to contribute to thermal management

Semiconductor devices – including power semiconductors – require high thermal resistance because high temperatures can cause malfunctions or shorten life. In addition, the primary bonding materials currently used in power semiconductor package manufacturing generally include high-lead solder that is being replaced by other materials due to environmental impact2, SAC solder3 that has low heat resistance, and silver (Ag) sintering agents. The heating temperature of this product is 250 degrees Celsius, which enables transient diffusion coupling of the liquid phase4. Because the heat resistance temperature rises to 480 degrees Celsius after gluing, it has higher heat resistance than existing products. It can also be used with different types of bonded materials, as it can maintain a bonding strength of up to 50 MPa. Furthermore, this product is a lead-free bonding material and also features high bonding reliability that has passed the 3000-cycle heat cycle test.

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Since large area bonding is possible, apart from its application as a die attachment material for power semiconductors, it is also expected to be used as an alternative to TIMs. Various materials with high thermal conductivity have been developed to manufacture semiconductor packages, but the low thermal conductivity of TIM materials has been a bottleneck in the overall thermal design. This product is a bonding material that enables large-surface gluing of TIMs above 50 mm and has high thermal conductivity. It can be expected to contribute to thermal management in semiconductor package manufacturing.

TANAKA PRECIOUS METAL TECHNOLOGIES is dedicated to contributing to the development of the semiconductor market, which is expected to expand further. Our commitment to this market ensures that we will continue to innovate and provide solutions that meet the growing needs of the industry.

AgSn TLP sheet specifications

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1 A thermal interface material (TIM) is a thermally conductive material inserted between materials to dissipate unwanted heat generated in electronic devices.

2 Although lead is under the scope of the RoHS directive, use within the validity period is permitted for applications for which replacements are not scientifically or technically possible. However, the development of replacements is ongoing due to the expiration date exclusion.

3 SAC solder is a solder material that contains tin (Sn), silver (Ag) and (Cu).

4 Transient liquid phase diffusion joining, also known as TLP joining, is a joining method that temporarily melts and liquefies metals and those inserted into the joining surface, and then uses diffusion to join through isothermal solidification when performing diffusion joining.

ABOUT TANAKA

Since its founding in 1885, TANAKA has built a portfolio of products to support a diverse range of precious metals-focused business uses. TANAKA is the leader in Japan in terms of the amount of precious metals it handles. For many years, TANAKA has manufactured and sold precious metal products for the industry and supplied precious metals in such forms as jewelry and property. As experts in precious metals, all Group companies in Japan and around the world collaborate on production, sales and technology development to offer a full range of products and services. With 5,355 employees, the group’s consolidated net sales for the fiscal year ending December 2023 were ¥611.1 billion.

Official website: TANAKA PRECIOUS METAL TECHNOLOGIES

https://tanaka-preciousmetals.com/en/

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