SK hynix to unveil ‘Full Stack AI Memory Provider’ vision at CES 2025 By Investing.com

• SK hynix will present its technological capabilities, participating in the world’s largest consumer electronics fair, CES 2025, from January 7-10
• It features a wide range of products that drive the era of artificial intelligence, from HBM, the core of AI infrastructure, to next-generation memories such as PIM
• The company will introduce new opportunities in the era of artificial intelligence through technological innovation and provide irreplaceable value

SEOUL, South Korea, January 2, 2025 /PRNewswire/ — SK hynix Inc. (KS:) (or “Company”, www.skhynix.com). today that it will present its innovative AI memory technologies at CES 2025, which will be held in Las Vegas from January 7 to 10 (local time).

A large number of C-level executives, including the CEO Kwak No-jungCMO (chief marketing officer) Justin Kim and Chief Development Officer (CDO) Ahn Hyunwill attend the event. “We will be broadly introducing solutions optimized for on-device AI and next-generation AI memory, as well as flagship AI memory products such as HBM and eSSD at this CES,” he said. Justin Kim. “We hereby announce our technological competitiveness to prepare for the future as a ‘Full Stack AI Memory Provider.’¹‘.”

¹Full AI Memory Provider: It refers to a comprehensive AI memory supplier, providing comprehensive AI-related memory products and technologies

SK hynix will also run a joint exhibition stand with SK Telecom (NYSE:), SKC and SK Enmove, under the theme “Innovative AI, Sustainable Tomorrow.” The stand will show how Group SK Artificial intelligence infrastructure and services are transforming the world, represented in waves of light.

SK hynix, which was the first in the world to produce 12-layer HBM products for the 5th generation and supply them to customers, will exhibit samples of HBM3E 16-layer products, which were officially developed last November. This product uses an advanced MR-MUF process to achieve the largest 16-layer configuration in the industry, while simultaneously controlling chip bending and maximizing heat dissipation performance.

In addition, the company will showcase high-capacity and high-performance business SSD products, including the ‘D5-P5336’ 122TB model developed by its subsidiary Solidigm last November. This product, with the largest existing capacity, high power and space efficiency, is attracting significant interest from AI data center customers.

“As SK Hynix was able to develop QLC² (Quadruple Level Cell) 61TB product in December, we expect to maximize synergies based on the balanced portfolio between the two companies in the high-capacity eSSD market,” he said. Ahn HyunCDO at SK hynix. The company will also showcase AI products on a device such as the ‘LPCAMM2³‘ and ‘ZUFS 4.0⁴,’ which improve data processing speed and energy efficiency for implementing artificial intelligence in edge devices such as PCs and smartphones. The company will also present CXL and PIM (Processing in Memory) technologies, along with modularized versions, CMM (CXL Memory Module)-Ax and AiMX⁵designed to be the foundational infrastructure for next-generation data centers.

²QLC: NAND flash is divided into SLC (Single Level Cell), MLC (Multilevel cell), TLC (Triple Level Cell), QLC (Quadruple Level Cell) and PLC (Penta level cell) depending on how much information is stored in one cell. As the amount of information stored increases, more data can be stored in the same area.

³Low Power Compressed Memory Module 2 (LPCAMM2): A module solution based on LPDDR5X that provides energy efficiency and high performance, as well as space saving. It has the effect of replacing two existing DDR5 SODIMMs with one LPCAMM2.

⁴Zoned Universal Flash Memory (ZUFS): A NAND Flash product that improves data management efficiency. The product optimizes data transfer between the operating system and the storage device by storing data with similar characteristics in the same zone of UFS, a flash memory product for various electronic devices such as digital cameras and mobile phones.

⁵Accelerator based on In-Memory Accelerator (AiMX): SK hynix’s accelerator card product that specializes in large language models using GDDR6-AiM chips

In particular, the CMM-Ax is a revolutionary product that adds compute functions to CXL’s high-capacity memory expansion advantage, contributing to improved performance and energy efficiency of next-generation server platforms⁶.

⁶Platform: It refers to a computer system that integrates hardware and software technologies. It includes all the key components needed for computing, such as CPU and memory.

“Changes in the world driven by artificial intelligence are expected to further accelerate this year, and SK Hynix will produce 6^th generation HBM (HBM4) in the second half of this year to lead the customized HBM market to meet different customer needs, he said Kwak Noh-JungCEO of SK hynix. “We will continue to do our best to introduce new possibilities in the era of artificial intelligence through technological innovation and provide irreplaceable value to our customers.”

About SK hynix Inc.

SK hynix Inc.based in Koreais a leading global semiconductor supplier offering dynamic direct access memory (“DRAM”) chips, flash memory chips (“NAND flash”) and CMOS image sensors (“CIS”) to a wide range of prestigious customers worldwide. The Company’s shares are traded on Korea Stock Exchangeand Global depository shares are listed at Luxembourg Stock Exchange. Additional information about SK hynix is ​​available at www.skhynix.com, news.skhynix.com.